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This new material will be used for electronic product packaging, that is, encapsulating silicon chips. According to NEC, no biodegradable plastic has previously achieved the heat resistance and rigidity required for electronic encapsulation. The new material has a thermal deformation temperature of 120°C, which is almost twice as high as that of the non-reinforced PLA (67°C). The flexural modulus is 7.6GPa, which is also higher than that of 4.5GPa without PLA. The new material will replace A BS and glass fiber reinforced ABS, and NEC expects to implement the biodegradable plastic industrially within 2 years. According to NEC Corporation of Japan, the company currently uses PLA made by many different material companies to prepare PLA/Ke-naf biodegradable plastics, but in the near future, it will cooperate with fixed PLA material manufacturers to produce PLA/Kenaf composites. .
NEC Corporation, a Japanese electronics and electronics company, announced the development of a bio-degradable plastic for electronic applications. The material contains PLA and 20% natural fibers called Kenaf.